T-862 DGC 3IN1 DIGITAL INFRARED SYSTEM

BGA/IRDA/IFR/SMD/SMT WELDER

BASIC REWORK REFLOW SOLDERING STATION

USES: MOBILE PHONES - DIGITAL CAMERAS - SMALL COMPONENTS

Features: 

★. (1) Use of infrared welding technology which is developed independently.   

★. (2) Use of an infrared heat lamp. Heat is easy to pierce and distribute evently, which overcome disadvantage (burn out elements) of traditional welding machines.

★. (3) Easy operation. You just need one-day training and you can operate it skillfully. 

★. (4) No need for unsolder tools. IRDA Welder T-862 can unsolder all the elements between 05 and 20mm.  

★. (5) This machine has 650W hot-melt system .Its preheating area is 80x120mm.   

★. (6) Infrared heating without heated air flowing .No impact on circumjacent small elements. It is suitable for the elements, especially Micro BGA elements.

Technical Parameters

  Working Voltage

  AC220/110V 50/60Hz

  Output Power

  600W

  Temperature

  100°C - 350°C

List of content

  Welder base

  1

  Guide rod 

  1

  Locating ring 

  1

  Lamp assy

  1

  Circuit Board(PCB) support

  1

  Power Cable

  1

  Soldering iron

  1

  Soldering iron support 

  1

  User manual

  1

Description of the main parts:

(1) Main Body

(2) Front Panel

(3) Back Panel

(4) Focusing Support

  

    

The Puhui T-862 soldering/rework station from Puhui Technologies, an entry level desoldering/soldering rework station for surface or hole mount components. With T-862, you get a temperature controlled rework welder station with all the enhancements including IRDA preheating surface, Infrared centered or disipated preheating, and Soldering Iron. All controllers are fully digital.

FOR BGA, use the IRDA Ceramic preheating plate and your Infrared light gun for the Mini BGA chips or chips secured by hooks in the middle of the chips, for turbo car chips or controlling speed chips is special to mount, dismount and make controlling boards.

This rework station is ESD-Safe and it is made of metal and coated with a static-dissipative paint and allows for Soldering and desoldering BGA, Mini BGA, QFP, SOP, PLCC or SOJ.  

THIS IS A GOOD MACHINE FOR MINI LAPTOPS, MEDIUM LAPTOPS AND MINI BOARDS, SPECIALLY MOBILE PHONE ONES OR MAYBE TURBO CHIPS, BUT WONT DO BIG CHIPS.

© 2010 Dragon Group China